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Chonghe Wang

Massachusetts Institute of Technology · US
Area of research
Biomedical Engineering · Radiology, Nuclear Medicine and Imaging
Research interest
Research interests include Advanced Sensor and Energy Harvesting Materials, Non-Invasive Vital Sign Monitoring, Photoacoustic and Ultrasonic Imaging, and Ultrasound Imaging and Elastography.
h-index
16
citations
5,123
works
31
NIH funding
primary concept
Materials science
email

Recent publications

Wearable bioadhesive ultrasound shear wave elastography
Science Advances 2024cited by 99position: middledoi
See how your body works in real time — wearable ultrasound is on its way
Nature 2024cited by 18position: firstdoi
A fully integrated wearable ultrasound system to monitor deep tissues in moving subjects
Nature Biotechnology 2023cited by 317position: middledoi
Stretchable ultrasonic arrays for the three-dimensional mapping of the modulus of deep tissue
Nature Biomedical Engineering 2023cited by 126position: middledoi
Laminin-coated electronic scaffolds with vascular topography for tracking and promoting the migration of brain cells after injury
Nature Biomedical Engineering 2023cited by 24position: middledoi
Bioadhesive ultrasound for long-term continuous imaging of diverse organs
Science 2022cited by 554position: firstdoi
Continuous monitoring of deep-tissue haemodynamics with stretchable ultrasonic phased arrays
Nature Biomedical Engineering 2021cited by 252position: firstdoi
Three-dimensional transistor arrays for intra- and inter-cellular recording
Nature Nanotechnology 2021cited by 76position: middledoi
Strain engineering and epitaxial stabilization of halide perovskites
Nature 2020cited by 686position: middledoi
A fabrication process for flexible single-crystal perovskite devices
Nature 2020cited by 425position: middledoi
Monitoring of the central blood pressure waveform via a conformal ultrasonic device
Nature Biomedical Engineering 2018cited by 867position: firstdoi
Materials and Structures toward Soft Electronics
Advanced Materials 2018cited by 647position: middledoi
Three-dimensional integrated stretchable electronics
Nature Electronics 2018cited by 538position: middledoi
Stretchable ultrasonic transducer arrays for three-dimensional imaging on complex surfaces
Science Advances 2018cited by 349position: middledoi
Controlled Homoepitaxial Growth of Hybrid Perovskites
Advanced Materials 2018cited by 108position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

Sheng Xu · Yale University7 papers (2018–2021)Yimu Chen · Shenzhen Institute of Information Technology6 papers (2018–2021)Yue Gu · China University of Mining and Technology6 papers (2018–2021)Chunfeng Wang · Autoliv (Sweden)6 papers (2018–2020)Yusheng Lei · Guangxi University6 papers (2018–2021)Hongjie Hu · High Magnetic Field Laboratory6 papers (2018–2021)Zhenlong Huang · University of Electronic Science and Technology of China5 papers (2018–2018)Yang Li · Southwest University of Science and Technology5 papers (2018–2020)Xiaoshi Li · Ministry of Natural Resources4 papers (2018–2018)Tianjiao Zhang · Nanjing Agricultural University4 papers (2018–2018)Nam-Heon Kim · Ajou University3 papers (2018–2018)Xuanhe Zhao · Massachusetts Institute of Technology3 papers (2022–2024)Mitsutoshi Makihata · Flanders Make (Belgium)3 papers (2018–2022)Qifa Zhou · Sun Yat-sen University3 papers (2018–2024)Muyang Lin · Centre for Human Genetics3 papers (2018–2021)Zhuorui Zhang · Hong Kong Polytechnic University3 papers (2018–2021)Woojin Choi · Ulsan National Institute of Science and Technology2 papers (2018–2020)Yuxuan Guo · University of California, Los Angeles2 papers (2018–2018)Akihiro Nomoto · Central Research Institute of Electric Power Industry2 papers (2018–2018)Hsiao‐Chuan Liu · University of Southern California2 papers (2022–2024)