Weixiang Peng

Area of research

Automotive Engineering · Materials Chemistry

Research interest

Research interests include Materials science, Thermal conductivity, Composite material, Boron nitride, Thermal management of electronic devices and systems, and Electronics.

h-index

—

citations

189

works

NIH funding

—

primary concept

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Recent publications

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging

Advanced Materials 2022cited by 184position: middledoi

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (Adv. Mater. 38/2022)

Advanced Materials 2022cited by 5position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

Shike Liu · National University of Singapore2 papers (2022–2022)Hongying He · National University of Singapore2 papers (2022–2022)Xin Ying Chan · National University of Singapore2 papers (2022–2022)Junbo Liu · Beijing Institute of Technology2 papers (2022–2022)Li Lu · China XD Group (China)2 papers (2022–2022)Hortense Le Ferrand · National University of Singapore2 papers (2022–2022)