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Z. Pan

University of Chicago · US
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Area of research
Astronomy and Astrophysics · Electrical and Electronic Engineering
Research interest
Research interests include Superconducting and THz Device Technology, Radio Astronomy Observations and Technology, Cosmology and Gravitation Theories, and Radio Frequency Integrated Circuit Design.
h-index
16
citations
1,061
works
60
NIH funding
primary concept
email

Recent publications

Cosmology from CMB lensing and delensed <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mi>E</mml:mi><mml:mi>E</mml:mi></mml:math> power spectra using 2019–2020 SPT-3G polarization data
Physical review. D/Physical review. D. 2025cited by 57position: middledoi
SPT-3G D1: Constraints on inflationary gravitational waves with two years of SPT-3G data
Physical review. D/Physical review. D. 2025cited by 6position: middledoi
First Constraints on the Epoch of Reionization Using the Non-Gaussianity of the Kinematic Sunyaev-Zel’dovich Effect from the South Pole Telescope and Herschel-SPIRE Observations
Physical Review Letters 2024cited by 22position: middledoi
Measurement of the CMB temperature power spectrum and constraints on cosmology from the SPT-3G 2018 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mml:mrow><mml:mi>T</mml:mi><mml:mi>T</mml:mi></mml:mrow></mml:mrow></mml:math>, <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mml:mi>T</mml:mi><mml:mi>E</mml:mi></mml:mrow></mml:math>, and <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mm
Physical review. D/Physical review. D. 2023cited by 147position: middledoi
Measurement of gravitational lensing of the cosmic microwave background using SPT-3G 2018 data
Physical review. D/Physical review. D. 2023cited by 62position: firstdoi
SPT-SLIM: A Line Intensity Mapping Pathfinder for the South Pole Telescope
Journal of Low Temperature Physics 2022cited by 30position: middledoi
Measurements of the <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mi>E</mml:mi></mml:math>-mode polarization and temperature-<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mi>E</mml:mi></mml:math>-mode correlation of the CMB from SPT-3G 2018 data
Physical review. D/Physical review. D. 2021cited by 259position: middledoi
Year two instrument status of the SPT-3G cosmic microwave background receiver
2018cited by 41position: middledoi
SPT-3G: A Multichroic Receiver for the South Pole Telescope
Journal of Low Temperature Physics 2018cited by 38position: middledoi
Design and Assembly of SPT-3G Cold Readout Hardware
Journal of Low Temperature Physics 2018cited by 19position: middledoi
Tuning SPT-3G Transition-Edge-Sensor Electrical Properties with a Four-Layer Ti–Au–Ti–Au Thin-Film Stack
Journal of Low Temperature Physics 2018cited by 17position: middledoi
Optimization of Transition Edge Sensor Arrays for Cosmic Microwave Background Observations With the South Pole Telescope
IEEE Transactions on Applied Superconductivity 2016cited by 73position: middledoi
Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera
Superconductor Science and Technology 2015cited by 37position: middledoi

Grants

Collaborative Research: SaTC: CORE: Medium: Security and Robustness for Intermittent Computing Using Cross-Layer Post-CMOS Approaches
NSF2303116$400,0002023–2026PIRePORTER
SHF: Medium: Integrating Human and Machine Intelligence for Next Generation Interactive Analog IC Design
NSF1704758$800,0002017–2024PIRePORTER
SHF: Small: Design/Technology Co-Optimization and Exploration in Emerging Scaling
NSF1718570$450,0002017–2023PIRePORTER
Collaborative Research: From High-level Synthesis to Layout: a Cross-layer Methodology for Large-scale Reliable IC Design
NSF1255816$125,0002013–2017PIRePORTER
SHF: SMALL: GOALI: Design for Manufacturability in Extreme Scaling with Emerging Nanolithography
NSF1218906$360,0002012–2017PIRePORTER
SHF: Small: Collaborative Research: Design for Manufacturability for 3D ICs with Through Silicon Vias
NSF1018750$200,0002010–2015PIRePORTER
CAREER: A Synergistic CAD Framework for Nanometer Design and Process Integration
NSF0644316$444,2042007–2015PIRePORTER

Frequent collaborators

M. Hollister · California Institute of Technology1 papers (2022–2022)M. Dobbs · Canadian Institute for Advanced Research1 papers (2022–2022)G. Robson · Cardiff University1 papers (2022–2022)K. S. Karkare · SLAC National Accelerator Laboratory1 papers (2022–2022)P. S. Barry · Cardiff University1 papers (2022–2022)Jeff McMahon · Electronics for Imaging (United States)1 papers (2022–2022)E. Shirokoff · Argonne National Laboratory1 papers (2022–2022)J. Montgomery · McGill University1 papers (2022–2022)J. E. Carlstrom · Argonne National Laboratory1 papers (2022–2022)C. L. Chang · Argonne National Laboratory1 papers (2022–2022)T. Cecil · Argonne National Laboratory1 papers (2022–2022)M. Rouble · McGill University Health Centre1 papers (2022–2022)A. J. Anderson · Fermi National Accelerator Laboratory1 papers (2022–2022) · 1 papers (2022–2022)B. A. Benson · Fermi National Accelerator Laboratory1 papers (2022–2022)Daniel P. Marrone · California Institute of Technology1 papers (2022–2022)G. Smecher · McGill University1 papers (2022–2022)
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