Fred Barlow

A Die Attach Design for Thermoelectric Generator Packages for Automotive Applications

Electronic Packaging: Semiconductor Packages ☆

Simulation and Measurement of Power Distribution Networks (PDN)

Delay estimation using SVD-based causal fourier continuations for high speed interconnects

Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects

Time Delay Extraction from Frequency Domain Data Using Causal Fourier Continuations for High-Speed Interconnects

A Study of Differential Signaling: Stable and Accurate Mixed-Mode Conversion and Extraction of Differential S-Parameters

Delay estimation using SVD-based causal fourier continuations for high speed interconnects

Time Delay Extraction from Frequency Domain Data Using Causal Fourier Continuations for High-Speed Interconnects

Thermal Cycling Reliability Study of Ag–In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes

Causality Enforcement of High-Speed Interconnects via Periodic Continuations

Finite Element Analysis and Fatigue Life Prediction of an Aluminum Alloy Braze for High Temperature Thermoelectric Generator Package Assembly

Zero Meta-material Ferroelectric Phase Shifter Embedded inside LTCC

Spectrally Accurate Causality Enforcement using SVD-based Fourier Continuations for High Speed Digital Interconnects

Numerical simulation of silicon wafer warpage due to thin film residual stresses

Prediction and Monitoring Systems of Creep-Fracture Behavior of 9Cr-1Mo Steels for Teactor Pressure Vessels

A new method for causality enforcement of DRAM package models using discrete hilbert transforms

Advanced Devices and Electronic Packaging for Harsh Environment

Comparison of passive enforcement techniques for DRAM package models

Modeling of Failure in Aluminum Alloy Braze for a High Temperature Thermoelectric Assembly

Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter

Numerical simulation of heat generation during the back grinding process of silicon wafers

Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments