Area of research
Electrical and Electronic Engineering · Mechanical Engineering
Research interest
Research interests include Electromagnetic Compatibility and Noise Suppression, Electrical Contact Performance and Analysis, Electronic Packaging and Soldering Technologies, and 3D IC and TSV technologies.
Fabrication of Graphite Flake/Al Composites Via Secondary Remelting Process: Synergistic Enhancement of Strength and Conductivity by Trace Doping
Fabrication of Graphite Flake/Al Composites Via Secondary Remelting Process: Synergistic Enhancement of Strength and Conductivity by Trace Doping
Fabrication of Graphite Flake/Al Composites Via Secondary Remelting Process: Synergistic Enhancement of Strength and Conductivity by Trace Doping
Investigation of signal integrity of fuzz button connectors under different compression states
Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure
Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder Balls
Modeling of the Signal Transmission of a Coaxial Connector With a Degraded Dielectric Layer in a Humid Environment
The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform
Impact of Multiple Insertions and Withdrawals, and Vibration on Passive Intermodulation in Coaxial Connectors
Investigation of impedance compensation in radio frequency circuits with bonding wire
Intelligent Detection Methods of Electrical Connection Faults in RF Circuits
Impact of Physical Dimensions and Dielectric Materials in Fuzz Button Interconnection Area on Signal Transmission
The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits
Impact of the Ball Grid Array Connection Failures on Signal Integrity
Impact of receptacle degradation and loose connection on signal integrity and electrical performance repeatability
Impact of Impedance Change Caused by Bonding Wire Connection on Signal Transmission
Modeling and Analysis of Signal Integrity of High-Speed Interconnected Channel With Degraded Contact Surface
High-Frequency Behavior Analysis and Modeling of Silver Plated Printed Circuit Board with Electrochemical Migration
The Impact of Electrical Contact Degradation on Differential Signal Transmission of High Speed Channel
Investigation of the improvement of signal integrity in electrical circuits with degraded contacts using differential transmission