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Daijun Hu

National University of Singapore · SG
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Area of research
Mechanical Engineering · Materials Chemistry
Research interest
Research interests include Materials science, Plasticity, Dislocation, Superalloy, Composite material, and Residual stress.
h-index
citations
401
works
9
NIH funding
primary concept
email

Recent publications

Heterointerface-induced stacking fault/dislocation modulation: A way to enhance work hardening and ductility in micro/nano-reinforced aluminum composites
International Journal of Plasticity 2025cited by 40position: middledoi
Anomalous anisotropy in an additively manufactured solid-solution-strengthened superalloy from room to elevated temperatures
International Journal of Plasticity 2025cited by 28position: middledoi
Trigonometric gradient microstructures in additively manufactured single crystals enable strength-ductility synergy and programmable performance
Nature Communications 2025cited by 6position: middledoi
A dislocation-based damage-coupled constitutive model for single crystal superalloy: Unveiling the effect of secondary orientation on creep life of circular hole
International Journal of Plasticity 2024cited by 46position: middledoi
Anisotropic and high-temperature deformation behavior of additively manufactured AlSi10Mg: Experiments and microscale modeling
Additive manufacturing 2024cited by 19position: middledoi
Dislocation structures formation induced by thermal stress in additive manufacturing: Multiscale crystal plasticity modeling of dislocation transport
Journal of the Mechanics and Physics of Solids 2023cited by 77position: firstdoi
A precipitation strengthened high entropy alloy with high (Al+Ti) content for laser powder bed fusion: Synergizing in trinsic hot cracking resistance and ultrahigh strength
Acta Materialia 2023cited by 65position: middledoi
Microscale residual stresses in additively manufactured stainless steel: Computational simulation
Journal of the Mechanics and Physics of Solids 2022cited by 64position: firstdoi
Crystal plasticity model of residual stress in additive manufacturing using the element elimination and reactivation method
Computational Mechanics 2021cited by 56position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

Wentao Yan · University of Shanghai for Science and Technology8 papers (2021–2025)Nicolò Grilli · Purdue University West Lafayette4 papers (2021–2024)Shiwei Wu · National University of Singapore3 papers (2023–2025)Zixu Guo · National University of Singapore3 papers (2024–2025)Lei Fan · National University of Singapore2 papers (2023–2025)Yilun Xu · Shanghai University2 papers (2025–2025)Shi Dai · National University of Singapore1 papers (2024–2024)Chao Yang · Tongji University1 papers (2025–2025)Yongkun Mu · National University of Singapore1 papers (2023–2023)Feng Lin · Sun Yat-sen University Cancer Center1 papers (2025–2025)Sifan Zou · Northwestern Polytechnical University1 papers (2024–2024)Yung Zhen Lek · Nanyang Technological University1 papers (2023–2023)Shoufeng Yang · KU Leuven1 papers (2025–2025)Fan Chen · National University of Singapore1 papers (2021–2021)Xiaogang Li · Fudan University1 papers (2025–2025)Zhenhua Zhang · Shandong University1 papers (2025–2025) · 1 papers (2025–2025)Min Yang · National University of Singapore1 papers (2022–2022)Xiaojun Yan · Jiangxi University of Traditional Chinese Medicine1 papers (2024–2024)Yong‐Wei Zhang · Agency for Science, Technology and Research1 papers (2025–2025)
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