Area of research
Electrical and Electronic Engineering · Electronic, Optical and Magnetic Materials
Research interest
Research interests include Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Integrated Circuits and Semiconductor Failure Analysis, and Copper Interconnects and Reliability.
Effect of Thermal Cycling on Reliability of QFN Packages
A Novel Numerical Multiphysics Framework for the Modeling of Cu-Al Wire Bond Corrosion under HAST Conditions
Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System
Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
Comparison of Reliability of Copper, Gold, Silver, and Pcc Wirebonds Under Sustained Operation at 200C
Effect of EMCs on the high current reliability of Cu wirebonds operating in harsh environments
Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper–Aluminum Wirebond in PEMs
Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments
Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity
ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments
De-bonding simulation of Cu-Al wire bond intermetallic compound layers
Prognostication of Cu-Al WB system subjected to high temperature-humidity condition
Multiphysics-modeling of corrosion in copper-aluminum interconnects in high humidity environments
Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments
Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity
Degradation mechanisms in electronic mold compounds subjected to high temperature in neighborhood of 200°C
Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity
High Temperature Storage and HAST Reliability of Copper-Aluminum Wirebond Interconnects
Damage mechanisms in copper-aluminum wirebond under high temperature operation