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Bin Chen
Nanchang University
· CN
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Area of research
Electrical and Electronic Engineering · Mechanical Engineering
Research interest
Research interests include Materials science, Soldering, Intermetallic, Microstructure, and Isothermal process.
h-index
—
citations
46
works
1
NIH funding
—
primary concept
—
email
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Recent publications
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
Materials Characterization
2023
cited by
46
position: middle
doi
Grants
No grants ingested yet.
Frequent collaborators
Wenjing Chen
· South China Agricultural University
1
papers (2023–2023)
Jue Wang
· Tongji University
1
papers (2023–2023)
Qinglin Li
· Jilin University
1
papers (2023–2023)
Yifan Huang
· Nanchang University
1
papers (2023–2023)
Zezong Zhang
· Nanchang University
1
papers (2023–2023)
Sifan Tan
· Nanchang University
1
papers (2023–2023)
Guangyu Zhu
· Nanchang University
1
papers (2023–2023)
Xiongxin Jiang
· Nanchang University
1
papers (2023–2023)
Xiaowu Hu
· Nanchang University
1
papers (2023–2023)
Yinshui He
· Nanchang University
1
papers (2023–2023)
Lan Jiang
· Nanchang University
1
papers (2023–2023)
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