Area of research
Molecular Biology · Neurology
Research interest
Research interests include Cerebrovascular and genetic disorders, Coral and Marine Ecosystems Studies, Gut microbiota and health, and Cancer-related gene regulation.
Sex- and age-associated factors drive the pathophysiology of MASLD
Recent Advances in Grayanane Diterpenes: Isolation, Structural Diversity, and Bioactivities from Ericaceae Family (2018–2024)
Gut microbes exacerbate systemic inflammation and behavior disorders in neurologic disease CADASIL
Distinct Functional Metagenomic Markers Predict the Responsiveness to Anti-PD-1 Therapy in Chinese Non-Small Cell Lung Cancer Patients
Dissecting spatial heterogeneity and the immune-evasion mechanism of CTCs by single-cell RNA-seq in hepatocellular carcinoma
A specific RIP3 <sup>+</sup> subpopulation of microglia promotes retinopathy through a hypoxia-triggered necroptotic mechanism
Association between the nasopharyngeal microbiome and metabolome in patients with COVID-19
The microbiome in inflammatory bowel diseases: from pathogenesis to therapy
Metagenomic analysis of the gut microbiome in atherosclerosis patients identify cross‐cohort microbial signatures and potential therapeutic target
Exploration of the effect of probiotics supplementation on intestinal microbiota of food allergic mice.
PubMed 2017cited by 41position: middle
The oral and gut microbiomes are perturbed in rheumatoid arthritis and partly normalized after treatment
MEMS Packaging for Reliability and Rapid Prototyping
Damage Tolerance in Mircoelectronic Packaging
U.S.-Japan Cooperative Science: Failure Mechanisms and Mechanics of Microelectronic Packaging
Presidential Faculty Faculty Award: A Unified Approach to Damage Tolerant Design and Manufacturing of Microelectronic Devices
U.S.-China Cooperative Research: Damage Tolerance in Micro- electronic Packaging
U.S.-China Cooperative Research: Damage Tolerance in Micro- electronic Packaging
U.S.-China Cooperative Research: Reliability of Microelectronic Packaging and Interconnects
Damage Tolerance in Mircoelectronic Packaging