Area of research
Electrical and Electronic Engineering · Mechanical Engineering
Research interest
Research interests include Materials science, Soldering, Microstructure, Intermetallic, Isothermal process, and Corrosion.
Effect of Ni-modified reduced graphene oxide on the mechanical properties of Sn–58Bi solder joints
Corrosion characteristics of Sn-20Bi-xCu-yIn solder in 3.5% NaCl solution
The electrochemical corrosion behavior of Sn58Bi-XCr composite solder
Effect of Ni and TiO2 particle addition on the wettability and interfacial reaction of Sn20Bi lead-free solder
Interface reaction and mechanical properties of Sn58Bi-XCr/Cu30Zn (Cu7Sn) solder joints under isothermal aging conditions
Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions
The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder