Area of research
Electrical and Electronic Engineering · Condensed Matter Physics
Research interest
Research interests include Materials science, Composite material, Sintering, Microstructure, Nanotechnology, and Copper.
Review of Inorganic Nonmetallic Materials in Power Electronics Packaging Application
Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles
Microscale mechanical properties in sintered copper nanoparticles
Nondestructive analysis of interface damage and stress in Al-ion implanted 4H-SiC homoepitaxial wafers via micro-Raman and multiscale simulation
Tailoring microstructure and mechanical properties of sintered Cu nanoparticles
Quartet structure generation set algorithm based 3D reconstruction on porous structures of sintered copper joints for power electronics packaging
Copper-based composite sintering materials and reliability analysis for power electronics packaging
Review of Die-Attach Materials for SiC High-Temperature Packaging
Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy
Hybrid microstructure-based stretchable biosensors for multi-physiological signal sensing
From Short Circuit to Completed Circuit: Conductive Hydrogel Facilitating Oral Wound Healing
Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures
Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Optimizing the chemical vapor deposition process of 4H–SiC epitaxial layer growth with machine-learning-assisted multiphysics simulations
Prediction of Temperature‐Dependent Stress in 4H‐SiC Using In Situ Nondestructive Raman Spectroscopy Characterization
Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
Rectification in Ionic Field Effect Transistors Based on Single Crystal Silicon Nanopore
Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics simulation study
Advanced Composites Inspired by Biological Structures and Functions in Nature: Architecture Design, Strengthening Mechanisms, and Mechanical‐Functional Responses
High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks
Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method
Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging
Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules
Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging
Exploring the feasibility and conduction mechanisms of P-type nitrogen-doped β-Ga<sub>2</sub>O<sub>3</sub> with high hole mobility