Area of research
Electrical and Electronic Engineering · Condensed Matter Physics · CRISPR base editing
Research interest
Research interests include Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, GaN-based semiconductor devices and materials, and Combustion and flame dynamics.
Nondestructive analysis of interface damage and stress in Al-ion implanted 4H-SiC homoepitaxial wafers via micro-Raman and multiscale simulation
Tailoring microstructure and mechanical properties of sintered Cu nanoparticles
Effects of Al addition on the mechanical and corrosion properties of NbTaTiV high-entropy alloy
Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy
Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Prediction of Temperature‐Dependent Stress in 4H‐SiC Using In Situ Nondestructive Raman Spectroscopy Characterization
Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
A Profile of Influenza Vaccine Coverage for 2019-2020: Database Study of the English Primary Care Sentinel Cohort.
Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics simulation study
High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures
A Profile of Influenza Vaccine Coverage for 2019-2020: Database Study of the English Primary Care Sentinel Cohort (Preprint)
Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation.
Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models
Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models.
Determination of stress components in a complex stress condition using micro-Raman spectroscopy.
Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes
Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study
Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network
Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm<sup>2</sup> Heat Dissipation
Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode
Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms
Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging
High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring.
Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model.
Correction: Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance.
High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring
Ultra-High Sensitive NO<sub>2</sub> Gas Sensor Based on Tunable Polarity Transport in CVD-WS<sub>2</sub>/IGZO p-N Heterojunction.