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K Pearsall

Karlsruhe Institute of Technology · DE
Area of research
Electrical and Electronic Engineering · Management of Technology and Innovation
Research interest
Research interests include Electronic Packaging and Soldering Technologies, Quality Function Deployment in Product Design, Quality and Supply Management, and Hydrogen embrittlement and corrosion behaviors in metals.
h-index
4
citations
37
works
71
NIH funding
primary concept
email

Recent publications

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: firstdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 1position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

Jeffrey C. Suhling · Auburn University30 papers (2015–2023)K Yokouchi · Intel (United States)29 papers (2019–2023)Pradeep Lall · Auburn University29 papers (2019–2023)Ravi Mahajan · Intel (United States)29 papers (2019–2023)Denise Manning · Intel (United States)29 papers (2019–2023)Patrick McCluskey · University of Maryland, College Park29 papers (2019–2023)Karlheinz Bock · Technische Universität Dresden29 papers (2019–2023)Mark D. Poliks · Binghamton University21 papers (2022–2023)Alan Huffman · Fermi Research Alliance21 papers (2022–2023)B Chan · Agency for Science, Technology and Research21 papers (2022–2023)W Sauter · Intel (United States)21 papers (2022–2023)C.-S Tan · Intel (United States)21 papers (2022–2023)Avram Bar‐Cohen · Intel (United States)21 papers (2022–2023)S Kroehnert · Intel (United States)21 papers (2022–2023)Thomas Braun · University of Basel20 papers (2022–2023)S Iyer · Intel (United States)20 papers (2019–2022)A Teng · Intel (United States)20 papers (2022–2023)Jin‐Ju Yang · Auburn University17 papers (2022–2023)Y Liu · Auburn University17 papers (2022–2023)C.-P Hung · Advanced Semiconductor Engineering (Taiwan)17 papers (2019–2023)