Area of research
Mechanical Engineering · Electrical and Electronic Engineering
Research interest
Research interests include Heat Transfer and Optimization, Heat Transfer and Boiling Studies, Electronic Packaging and Soldering Technologies, and Thermal properties of materials.
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
Two-Phase Flow Regimes and Heat Transfer Coefficients With R245fa in Manifolded-Microgap Channels
Experimental Demonstration of Pressure-Driven Flash Boiling for Transient Two-Phase Cooling
Encyclopedia of Packaging Materials, Processes, and Mechanics
Encyclopedia of Packaging Materials, Processes, and Mechanics
Encyclopedia of Packaging Materials, Processes, and Mechanics
Encyclopedia of Packaging Materials, Processes, and Mechanics
Encyclopedia of Packaging Materials, Processes, and Mechanics
Unified mechanistic multiscale mapping of two-phase flow patterns in microchannels