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A Teng

Intel (United States) · US
Area of research
Electrical and Electronic Engineering · Strategy and Management
Research interest
Research interests include Electronic Packaging and Soldering Technologies, Business Strategy and Innovation, and Biotechnology and Related Fields.
h-index
1
citations
1
works
30
NIH funding
—
primary concept
—
email
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Recent publications

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 1position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2021cited by 0position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

Avram Bar‐Cohen · Intel (United States)20 papers (2022–2023)Jeffrey C. Suhling · Auburn University20 papers (2022–2023)Karlheinz Bock · Technische Universität Dresden20 papers (2022–2023)S Kroehnert · Intel (United States)20 papers (2022–2023)K Pearsall · Karlsruhe Institute of Technology20 papers (2022–2023)K Yokouchi · Intel (United States)20 papers (2022–2023)Mark D. Poliks · Binghamton University20 papers (2022–2023)Pradeep Lall · Auburn University20 papers (2022–2023)Alan Huffman · Fermi Research Alliance20 papers (2022–2023)B Chan · Agency for Science, Technology and Research20 papers (2022–2023)Thomas Braun · University of Basel20 papers (2022–2023)Ravi Mahajan · Intel (United States)20 papers (2022–2023)W Sauter · Intel (United States)20 papers (2022–2023)C.-S Tan · Intel (United States)20 papers (2022–2023)Denise Manning · Intel (United States)20 papers (2022–2023)Patrick McCluskey · University of Maryland, College Park20 papers (2022–2023)Jin‐Ju Yang · Auburn University17 papers (2022–2023)Y Liu · Auburn University17 papers (2022–2023)G.-S Kim · Jeonbuk National University Hospital12 papers (2022–2022)Patrick Thompson · Hampshire County Council12 papers (2022–2022)