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B Chan

Agency for Science, Technology and Research · SG
Area of research
Electrical and Electronic Engineering · Polymers and Plastics
Research interest
Research interests include Electronic Packaging and Soldering Technologies, Polymer composites and self-healing, Electrospun Nanofibers in Biomedical Applications, and Advanced Sensor and Energy Harvesting Materials.
h-index
16
citations
1,376
works
45
NIH funding
primary concept
email

Recent publications

Electrically Conductive Polymers for Additive Manufacturing
ACS Applied Materials & Interfaces 2024cited by 40position: middledoi
Transforming textile waste into nanocellulose for a circular future
Nanoscale 2024cited by 21position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
Progress and opportunities in additive manufacturing of electrically conductive polymer composites
Materials Today Advances 2022cited by 109position: lastdoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2022cited by 0position: middledoi
Mechanically cartilage-mimicking poly(PCL-PTHF urethane)/collagen nanofibers induce chondrogenesis by blocking NF–kappa B signaling pathway
Biomaterials 2018cited by 101position: middledoi
Electrospun Pectin-Polyhydroxybutyrate Nanofibers for Retinal Tissue Engineering
ACS Omega 2017cited by 75position: middledoi
Recent Advances in Shape Memory Soft Materials for Biomedical Applications
ACS Applied Materials & Interfaces 2016cited by 373position: firstdoi
Elastic poly( <i>ε</i> -caprolactone)-polydimethylsiloxane copolymer fibers with shape memory effect for bone tissue engineering
Biomedical Materials 2016cited by 136position: middledoi
Biocompatible electrically conductive nanofibers from inorganic-organic shape memory polymers
Colloids and Surfaces B Biointerfaces 2016cited by 117position: middledoi

Grants

Development of a Modern Undergraduate Mathematics Laboratory
NSF8852470$8,2701988–1991PIRePORTER

Frequent collaborators

Ravi Mahajan · Intel (United States)21 papers (2022–2023)W Sauter · Intel (United States)21 papers (2022–2023)C.-S Tan · Intel (United States)21 papers (2022–2023)Denise Manning · Intel (United States)21 papers (2022–2023)Patrick McCluskey · University of Maryland, College Park21 papers (2022–2023)Avram Bar‐Cohen · Intel (United States)21 papers (2022–2023)Jeffrey C. Suhling · Auburn University21 papers (2022–2023)Karlheinz Bock · Technische Universität Dresden21 papers (2022–2023)S Kroehnert · Intel (United States)21 papers (2022–2023)K Pearsall · Karlsruhe Institute of Technology21 papers (2022–2023)K Yokouchi · Intel (United States)21 papers (2022–2023)Mark D. Poliks · Binghamton University21 papers (2022–2023)Pradeep Lall · Auburn University21 papers (2022–2023)Alan Huffman · Fermi Research Alliance21 papers (2022–2023)Thomas Braun · University of Basel20 papers (2022–2023)A Teng · Intel (United States)20 papers (2022–2023)Jin‐Ju Yang · Auburn University17 papers (2022–2023)Y Liu · Auburn University17 papers (2022–2023)S Iyer · Intel (United States)12 papers (2022–2022)Rozalia Beica · Auburn University12 papers (2022–2022)