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Vikalp Narayan

Auburn University · US
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Area of research
Electrical and Electronic Engineering · Industrial and Manufacturing Engineering
Research interest
Research interests include Electronic Packaging and Soldering Technologies, Industrial Vision Systems and Defect Detection, 3D IC and TSV technologies, and Material Properties and Processing.
h-index
2
citations
13
works
6
NIH funding
—
primary concept
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email
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Recent publications

Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage
IEEE Transactions on Components Packaging and Manufacturing Technology 2015cited by 6position: lastdoi
Model for prediction of package-on-package warpage and the effect of process and material parameters
2013cited by 5position: lastdoi
Effect of reflow process on glass transition temperature of printed circuit board laminates
2012cited by 2position: middledoi
Effect of Manufacturing Process Parameters on Property Evolution of Printed Circuit Board Laminates
Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B 2012cited by 0position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

Pradeep Lall · Auburn University4 papers (2012–2015)Mark Strickland · Marshall Space Flight Center2 papers (2012–2012)Kewal Patel · U.S. National Science Foundation2 papers (2013–2015)Jim Blanche · Marshall Space Flight Center2 papers (2012–2012)Jeff Suhling · Auburn University1 papers (2012–2012)
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