Area of research
Electrical and Electronic Engineering · Statistics, Probability and Uncertainty
Research interest
Research interests include Electronic Packaging and Soldering Technologies, Probabilistic and Robust Engineering Design, VLSI and FPGA Design Techniques, and 3D IC and TSV technologies.
Mechanical Properties and Microstructure Investigation of Lead Free Solder
NASA Technical Reports Server (NASA) 2013cited by 2position: middle
Best of conference papers - 2012
Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000g
Effect of reflow process on glass transition temperature of printed circuit board laminates
Effect of Manufacturing Process Parameters on Property Evolution of Printed Circuit Board Laminates
Area-Array Electronics Models and Survivability Under 50,000G Shock Loads