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José E. Schutt‐Ainé

University of Illinois Urbana-Champaign · US
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Area of research
Electrical and Electronic Engineering · Astronomy and Astrophysics
Research interest
Research interests include Electromagnetic Compatibility and Noise Suppression, Electromagnetic Simulation and Numerical Methods, Low-power high-performance VLSI design, and Lightning and Electromagnetic Phenomena.
h-index
26
citations
2,986
works
231
NIH funding
—
primary concept
—
email
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Recent publications

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
IEEE Transactions on Components Packaging and Manufacturing Technology 2023cited by 0position: middledoi

Grants

No grants ingested yet.

Frequent collaborators

W Sauter · Intel (United States)9 papers (2023–2023)C.-S Tan · Intel (United States)9 papers (2023–2023)S. Wong · Chinese University of Hong Kong9 papers (2023–2023)Denise Manning · Intel (United States)9 papers (2023–2023)Patrick McCluskey · University of Maryland, College Park9 papers (2023–2023)Grace O’Malley · Royal College of Surgeons in Ireland9 papers (2023–2023)C.-P Hung · Advanced Semiconductor Engineering (Taiwan)9 papers (2023–2023)Avram Bar‐Cohen · Intel (United States)9 papers (2023–2023)Jeffrey C. Suhling · Auburn University9 papers (2023–2023)Karlheinz Bock · Technische Universität Dresden9 papers (2023–2023)S Kroehnert · Intel (United States)9 papers (2023–2023)K Pearsall · Karlsruhe Institute of Technology9 papers (2023–2023)K Yokouchi · Intel (United States)9 papers (2023–2023)Mark D. Poliks · Binghamton University9 papers (2023–2023)Pradeep Lall · Auburn University9 papers (2023–2023)Alan Huffman · Fermi Research Alliance9 papers (2023–2023)B Chan · Agency for Science, Technology and Research9 papers (2023–2023)Ravi Mahajan · Intel (United States)9 papers (2023–2023)Y Taira · Intel (United States)8 papers (2023–2023)Y Liu · Auburn University8 papers (2023–2023)
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